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Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

Advances in Electronic Circuit Packaging: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado

342 Pages · 1962 · 22.64 MB · English

by D. A. Beck (auth.) & Gerald A. Walker (eds.)

“ Don't fear change. The surprise is the only way to new discoveries. Be playful! ” ― Gordana Biernat

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